MTK or severely damaged ultra high integration 3G communication solution released

Release date：2014-10-16   Views：4054

On October 13, at the fall Electronics Show in Hong Kong, SMIC and Intel jointly released xmm6321, a 3G communication solution. The chip adopts turnkey mode, which is the most integrated 3G solution in the world. It has the widest coverage of baseband technology in the world. It has the characteristics of one high and two low, namely, low cost, low power consumption, high integration and easy production. It is mainly aimed at the entry-level mobile phone and communication tablet market. Several mass-produced terminal products are also displayed in this conference, which is expected to bring a strong shock to the communication market Shake. The first official appearance of the chip makes the core micro quickly complete a new transformation and enter a new field.

Xmm6321 3G communication solution with the highest integration in the world

On the spot, Ruixin micro officially launched its first communication chip solution, xmm6321, which is the most integrated 3G SOC solution in the world. It is mainly aimed at entry-level mobile phones and call tablets below 3.5-7 inches. It will be mass produced in late October.

Figure 1

Xmm6321 is a WCDMA SOC processor solution, supporting Unicom 3G and GSM dual card dual standby, integrating WiFi, Bluetooth, GPS and PMU components. The biggest bright spot is that the whole solution only uses two chips to accommodate all devices, which is the highest integration of 3G SOC solutions in the world. It has three characteristics of "one high and two low"

First, the world's most integrated entry-level 3G communication solution.

Compared with the four chips in the same scheme, xmm6321 only uses two chips and integrates WiFi, Bluetooth, GPS and PMU components. High integration will greatly reduce the number of PCBA components in the production of terminal equipment manufacturers, and the production process and product speed will be faster. The damage rate of xmm6321 is lower than that of the other four. Higher integration also brings better overall stability. Both 3G and GSM support four frequency bands, and OEM brands can flexibly choose the frequency band collocation.

Second, low power consumption, stable and mature baseband technology.

Xmm6321 adopts Intel baseband (original Infineon), with extremely low power consumption. The baseband technology has great advantages in the world with wide certification and mature application (Apple's first generation 3G smart phone, that is, the baseband Technology). In view of the different recognition standards of baseband in different countries and regions, the requirements of baseband in terms of frequency band, signal sensitivity, stability and coverage are usually very high. The stability of baseband brings huge competitive advantages to the global communication field of Ruixin micro xmm6321.

Third, the cost is greatly reduced and the time for mass production is reduced.

The high integration of 2in1 based on Ruixin micro xmm6321 can save more costs for manufacturers. It is not only easier to produce, but also helps to improve the stability of terminal communication products and ensure that the products of manufacturers enter the market quickly.

Circuit diagram of Ruixin micro 3G / lte4g chip exposed

Ruixin micro released a detailed product circuit diagram at the scene. It is understood that Sofia 3G series and Sofia LTE series will be launched in succession, and all chips will adopt 64 bit CPU, and will be optimized for the new Android L system platform. It is expected that they will be launched one after another in the first quarter of 2015, when there will be five to six chips for the consumer market.

Figure 2

Through the release of 3G / 4G LTE new communication solutions, Ruixin micro has also completed the leap forward transformation to a new field. Through more mature baseband and leading technology, Ruixin micro officially sounded the clarion call to enter the communication market.

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